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Project directory

Multiscale Interferometric Scanning Stage

HARD MASK DEEP ETCHING

SAFETY/SECURITY-ORIENTED POST INSTRUMENTATION OF CIRCUITS WITH ASSERTIONS

MINAPACK: MIcro and NAno technology for PACKaging

Printed circuits on flexible substrates

Chip-On-Chip technology to Open new Applications

ULTIMATE ENABLEMENT RESEARCH ON 32/28NM CMOS TECHNOLOGIES

novel, SATellite application, IC and module PACKaging

Compact Hot Infrared Component