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COCOA

COCOA

Chip-On-Chip technology to Open new Applications

In progress

Project holder

STMicroelectronics Grenoble

Partners

Leti

Non-members Partners

ST-Ericsson

Challenges

Cocoa aims at developing a complete mature 3D integration technology platform covering the entire range of processes required from vertical interconnects (TSV, micro bumps...) and robust bonding to innovative packaging approaches to address a wide range of products.

Objectives

Compared to the existing collaborative projects dealing with 3D integration, COCOA specifically addresses: 1)3D interconnects shrink and the associated specific development process steps to increase density and cover the existing gap between medium and high density technologies, 2)3D performance (thermal, mechanical, electrical...) improvement. This technology platform will have a great impact on a wide range of applications; which will be demonstrated by the realization of product demonstrators

Projet infos page d'un projet

Markets

Basic Technologies

Budget

NC

Duration

36 month

Human resources allocated

175.5 men/year