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CUIVRE

CUIVRE

In progress

Challenges

The Cuivre project will give microelectronics manufacturers a cutting-edge process--called ElectroChemical Pattern Replication, or ECPR™--for depositing copper patterns on wafers.

Objectives

ECPR™ uses a pioneering electrochemical deposition technique that makes it easier to generate micro and nanoscale copper patterns and some types of components--all with enhanced pattern precision and improved form factors.

Projet infos page d'un projet

Markets

Basic Technologies

Budget

NC

Duration

36 month

Human resources allocated

NC