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MINAPACK

MINAPACK

MINAPACK: MIcro and NAno technology for PACKaging

Completed

Project type

FUI 7

Project holder

NovaPack

Partners

Gamberini, Serma Technologies, Leti

Non-members Partners

Egide

Challenges

The MINAPACK project targets the cavity package market, estimated annually at $2 billion, and aims to develop and test new Level 1 cavity packages by using rupture material and process technologies. These packaging could be used in the following applications: power lasers, telecom fiber lasers, RF and HF, MEMS sensors, imaging, 3D mechatronics, healthcare, energy conversion, low-power, embedded, and high-temperature electronics, and systems-onplastic (SOPs).

Objectives

The MINAPACK project will develop new processes to make cavity packages using the following rupture materials and process technologies: - Inorganic micro- and nano-materials - Liquid crystal polymers (LCPs) and their charges - Composite materials for thermal management (instead of heavier, less-efficient metals or alloys) - Low-temperature assemblies - Beyond screen-printing high-performance metallization capabilities - Plating finishing suitable for all the above Generally, use low-cost materials and processes to deliver beyond state-of-the-art performance and lower costs, without sacrificing any of the reliability needed for chips needing a cavity, like air-tightness or hermeticity (total or relative).

Projet infos page d'un projet

Markets

Basic Technologies

Budget

3,289 K€

Duration

36 month

Human resources allocated

18.17 men/year