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OSIRIS

OSIRIS

Ultrasonic probe card cleaner

Completed

Project type

FUI 8

Project holder

Ceprim Technologies

Partners

STMicroelectronics Grenoble

Non-members Partners

Global Technologies, SIMaP - Science et Ingénierie des Matériaux et Procédés, LEPMI - Laboratoire d'Electrochimie et de Physicochimie des Matériaux et des Interfaces, STMicroelectronics Rousset

Challenges

The Osiris project aims to develop an industrial cleaning and repackaging machine for test probes that is repeatable, easy-to-use, and reliable, and does not mechanically alter the probes. The goal is to increase probe card lifetime, improve electronic yields, and cut testing costs. The first step of the project will be to build a machine prototype.

Objectives

The major innovation with Osiris will be the use of high-frequency ultrasound waves (frequencies of a few hundred kHz), which are much less abrasive than lower-frequency ones. The waves' effects will be enhanced by select chemical phenomena that don't occur at lower frequencies, and which can be used to perform targeted cleaning with non-polluting solutions.

Projet infos page d'un projet

Budget

1,029 K€

Duration

24 month

Human resources allocated

8.1 men/year