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Koelis announces first procedures in 3D fusion imaging-guided focal ablation of prostate cancer in its clinical study VIOLETTE.
12/04/2021
MEYLAN, France, April 8th, 2021 – KOELIS, an international leader in prostate...
Introducing Dolphin Design’s new Audio CODEC for TWS devices with ANC capabilities
22/03/2021
Dolphin Design, leader in Voice and Audio solutions for the IoT, wireless and wearables markets, launches its new high-fidelity, ultra-low power audio CODEC designed for TWS applications with ANC capabilities.
DOLPHIN DESIGN : CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%
22/02/2021
Joint Paper Presented at ISSCC 2021 Shows How New Adaptive Back-Biasing Technique Overcomes Integration Limits in Chip Design Flows
X-FAB : IC’Alps joins X-FAB design & supply chain partner network to better support X-FAB’s customers with ASIC development
04/02/2021
IC’Alps, French expert in design and supply of application-specific integrated circuits (ASIC), today announced it has joined the design and supply chain partner network of specialty foundry X-FAB.
SET European reseller of the OntosTT atmospheric plasma system
22/01/2021
The world's leading supplier of high precision flip-chip bonders SET will now...
CORIAL's Top Blog Posts of 2020
14/01/2021
For more than 30 years we have been providing those in industry...
TELEDYNE E2V’s Radiation Tolerant Quad ARM® Cortex®-A72 Space Processor Successfully Passes 100krad TID Testing
16/12/2020
Teledyne e2v has announced that its popular LS1046-Space processor has now passed stringent total ionizing dose (TID) radiation tests, achieving 100krad resilience.
TELEDYNE E2V : Discover Teledyne e2v ADC Proof of Concept – Capable of Sampling Directly from P to Ka BandV
16/12/2020
Teledyne e2v has further underlined its commitment to revolutionizing RF systems through the ongoing development of innovative, highly-differentiated mixed signal solutions. The company has successfully demonstrated next generation data converter technology that its engineering team is currently in the process of testing.
TELEDYNE E2V’s New Services Relieve Thermal & Power Constraints in Aerospace & Defense Systems
16/12/2020
Teledyne e2v has made further progression in its goal of actively supporting aerospace/defense customers in addressing the power and thermal constraints of their high-reliability (Hi-Rel) electronic processing platforms.
TELEDYNE E2V : World First Direct Microwave Synthesis DAC with 26GHz Output Bandwidth Now Sampling via Teledyne e2v
16/12/2020
Grenoble, 9th November 2020 – Teledyne e2v is moving ever closer to...
DOLPHIN DESIGN unveil a new and improved version of its Power Controller IP – MAESTRO - to speed-up energy-efficient SoC design
08/12/2020
Want to speed-up your Energy Efficient SoC design? Discover the new Power Controller RTL IP enabling to mix the configurability of a software PMU together with the lowest power consumption of a hardware PMU
PISEO : IRay T3S thermal camera performance analysis” report
30/11/2020
“IRAY’s camera produces thermal images on a smartphone and provides local temperature measurements” states Olivier ANDRIEU, PhD., Innovation Leader and System Architect at PISEO.