The funding enables Scintil to expand hiring in France and internationally, including the U.S., accelerate production, and deepen its international presence as it delivers the industry’s first single-chip DWDM (Dense Wavelength Division Multiplexing) light engine, integrating multi-wavelength lasers with silicon photonics, aligned with next-generation co-packaged optics (CPO). Scintil’s solutions are purpose-built to meet the high-bandwidth, low-latency, and high-density demands for next-generation AI infrastructure, delivering the scale, efficiency, and performance required for tomorrow’s most powerful GPU clusters.

“This investment marks a pivotal moment for Scintil as we move to full-scale deployment,” said Matt Crowley, CEO of Scintil Photonics. “Our SHIP™ technology enables integrated photonic solutions with the scalability, energy efficiency, and integration density required to power next-generation compute infrastructure. This efficiency not only reduces data center operating costs but also contributes to lowering the carbon footprint of AI infrastructure. With LEAF Light™ entering high-volume production, we’re expanding from our base in Grenoble into the international markets, including the U.S., to support the world’s most advanced AI factories.”

“We developed our LEAF Light™ integrated circuit in close collaboration with our customers. Used as an external laser source for Co-Packaged Optics (CPO) transmissions, it is a key component for the next generation of AI data centers. Its uniqueness lies in a single-chip solution that monolithically integrates precisely spaced DFB lasers on silicon photonic circuits, produced through a robust commercial supply chain,” said Sylvie Menezo, Founder and CTO of Scintil Photonics. “Our SHIP™ technology provides a strong and disruptive foundation to expand our portfolio of integrated photonic circuit solutions for the coming decades.”