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PHILEAS

PHILEAS

Phileas: Integrated, Reliable, Advanced Vacuum Packaging on Silicon

Completed

Project type

FUI 6

Project holder

ULIS

Partners

Tronics Microsystems, Leti

Non-members Partners

ONERA

Challenges

The Phileas project concerns the vacuum packaging used for uncooled infrared detectors and inertial sensors--both of which require low vacuum pressures (of <10-3 Torr) to function. Current vacuum packaging technologies are too expensive for use with infrared detectors for automotive and home automation applications, or with inertial sensors for the European aerospace industry.

Objectives

CEA-LETI has patented an innovative thin-film packaging technology that can create a vacuum at the chip level--therefore eliminating the need for a vacuum package--while using conventional packaging technologies. Furthermore, the new technology does not require an infrared window to be added for infrared detectors. This wafer-wafer packaging using direct silicon-on-silicon sealing performs particularly well in inertial sensors. The project will also develop getter technology that can improve vacuum quality after sealing.

Projet infos page d'un projet

Budget

9,822 K€

Duration

36 month

Human resources allocated

59.76 men/year