Laser World of Photonics 2023: They will be there

Laser World of Photonics 2023: They will be there

Find out who will be attending

Laser World of Photonics is the international event that covers all optical, photonic and laser technologies. It is a must-attend event in the optics-photonics industry for prospecting the German market and meeting the sector’s key decision-makers.

Partnering with Business France, Minalogic offered its members the opportunity to exhibit in the French block under a “Choose France” banner.



FIBERCRYST Fibercryst produces ultrashort pulse lasers using innovative proprietary technology.
These lasers emit such short and powerful pulses that matter is instantly vaporized, thus allowing for very high-quality machining.
MATHYM Mathym is a nanotechnology company that develops and manufactures innovative nanoparticle dispersions and that supplies both R&D samples and industrial batches.
QiOVA QiOVA conceives intelligent industrial laser processing solutions, uniquely combining precision and productivity. Our tools are dynamically customizable through software, to meet industrial requirements at every step of the production process
HEF The HEF group is a world leader in surface engineering, capable of offering a comprehensive service – ranging from research to process operation or component supply, through industrial development and technology transfer – to its customers, whether major clients or SMEs.
Design of image sensors in CMOS technology


Other members will be exhibiting at this fair, but on their own account:

Teem Photonics Micro laser production for industrial and instrumentation applications
ALPAO ALPAO is an adaptive optics manufacturer for research and industry, offering a complete range of standardized and custom products.
CEDRAT TECHNOLOGIES SA CEDRAT TECHNOLOGIES SA innovates in the fields of Actuators and Sensors for Mechatronic and Sensing functions, through products, projects, and training.
SET (Smart Equipment Technology) SET (Smart Equipment Technology) designs, manufactures and markets flip-chip bonders. These hybridization machines align and bond a component to its substrate (chip or wafer) with a precision ranging from ± 5 µm to ± 0.5 µm.
THALES Thales is a world leader in high technology, investing in digital and deep tech innovations – connectivity, big data, artificial intelligence, cybersecurity, and quantum physics – to build a future of trust, which is essential for the development of our companies.


Want to know more? Contact:

Florent Bouvier
Florent Bouvier
Easytech program manager
+33 (0)6 35 03 98 52
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