Laser World of Photonics 2023: They will be there
Find out who will be attending
Laser World of Photonics is the international event that covers all optical, photonic and laser technologies. It is a must-attend event in the optics-photonics industry for prospecting the German market and meeting the sector’s key decision-makers.
Partnering with Business France, Minalogic offered its members the opportunity to exhibit in the French block under a “Choose France” banner.
|FIBERCRYST||Fibercryst produces ultrashort pulse lasers using innovative proprietary technology.
These lasers emit such short and powerful pulses that matter is instantly vaporized, thus allowing for very high-quality machining.
|MATHYM||Mathym is a nanotechnology company that develops and manufactures innovative nanoparticle dispersions and that supplies both R&D samples and industrial batches.|
|QiOVA||QiOVA conceives intelligent industrial laser processing solutions, uniquely combining precision and productivity. Our tools are dynamically customizable through software, to meet industrial requirements at every step of the production process|
|HEF||The HEF group is a world leader in surface engineering, capable of offering a comprehensive service – ranging from research to process operation or component supply, through industrial development and technology transfer – to its customers, whether major clients or SMEs.|
Design of image sensors in CMOS technology
Other members will be exhibiting at this fair, but on their own account:
|Teem Photonics||Micro laser production for industrial and instrumentation applications|
|ALPAO||ALPAO is an adaptive optics manufacturer for research and industry, offering a complete range of standardized and custom products.|
|CEDRAT TECHNOLOGIES SA||CEDRAT TECHNOLOGIES SA innovates in the fields of Actuators and Sensors for Mechatronic and Sensing functions, through products, projects, and training.|
|SET (Smart Equipment Technology)||SET (Smart Equipment Technology) designs, manufactures and markets flip-chip bonders. These hybridization machines align and bond a component to its substrate (chip or wafer) with a precision ranging from ± 5 µm to ± 0.5 µm.|
|THALES||Thales is a world leader in high technology, investing in digital and deep tech innovations – connectivity, big data, artificial intelligence, cybersecurity, and quantum physics – to build a future of trust, which is essential for the development of our companies.|