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S2P designs, develops and manufactures 3D-Molded Interconnect Devices / Plastronics products, where conductive tracks and electronic components are directly integrated on 3D complex surfaces, for a better miniaturization of your electronic systems. In addition to conventional PCB of flexboards, industrial technologies we use permit the construction of 3D antennas and RF components, 3D miniaturized sensors, 3D capacitive surfaces, 3D LED lighting modules, specific shields, 3D integrated connectors, ...