
About
S2P designs, develops and manufactures 3D-Molded Interconnect Devices / Plastronics products, where conductive tracks and electronic components are directly integrated on 3D complex surfaces, for a better miniaturization of your electronic systems. In addition to conventional PCB of flexboards, industrial technologies we use permit the construction of 3D antennas and RF components, 3D miniaturized sensors, 3D capacitive surfaces, 3D LED lighting modules, specific shields, 3D integrated connectors, ...
Type of Organization SME
Adress 5 Rue Pierre et Marie Curie - Bellignat
1100 BELLIGNAT
1100 BELLIGNAT
Year founded 2014
Themes Micro/nano/electronic, Photonic
Contact MOGUEDET Mael
CEO
CEO
Minalogic member since 12/02/2016
Markets Aerospace & Defense, Consumer goods, Healthcare, Industry 4.0, Mobility & Transport