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SET Corporation

SET Corporation

Type of Organization SME
Year founded 1975

About

SET (Smart Equipment Technology) is specialized in high accuracy flip-chip bonders for chip-to-chip and chip-to-wafer. Our equipment are used for aligning and bonding a component onto its substrate with a post-bond accuracy which varies from ± 5 µm down to ± 0.5 µm. Used for different kind of applications such as the assembly of focal plane arrays (IR, X-Ray, Gamma), optoelectronics components or for 3D integration, SET flip-chip bonders are appreciated for their flexibility. Based in the Northern French Alps and created in 1975, SET was the former Device Bonder Division of SÜSS MicroTec. Since 2012, SET has been a French company owned by its employees.

Type of Organization SME
Adress 131 Impasse Barteudet
74490 SAINT JEOIRE
Year founded 1975
Themes Micro/nano/electronic, Photonic
Contact METZGER Pascal
Minalogic member since 31/07/2013
Markets Industry 4.0
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