SET (Smart Equipment Technology) is specialized in high accuracy flip-chip bonders for chip-to-chip and chip-to-wafer. Our equipment are used for aligning and bonding a component onto its substrate with a post-bond accuracy which varies from ± 5 µm down to ± 0.5 µm. Used for different kind of applications such as the assembly of focal plane arrays (IR, X-Ray, Gamma), optoelectronics components or for 3D integration, SET flip-chip bonders are appreciated for their flexibility. Based in the Northern French Alps and created in 1975, SET was the former Device Bonder Division of SÜSS MicroTec. Since 2012, SET has been a French company owned by its employees.
74490 SAINT JEOIRE