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VERDI

VERDI

Verdi: High-density Vias and Die Bonding for 3D Integration

Completed

Project type

FUI 6

Project holder

STMicroelectronics Grenoble

Partners

Pfeiffer Vacuum, Leti, Air Liquide Electronics Systems

Non-members Partners

IMEP-LAHC - Institut de Microélectronique Electromagnétisme et Photonique et le LAboratoire d'Hyperfréquences et de Caractérisation

Challenges

3D integration is essential for making high-performance, multi-function circuits capable of performing all the PC tasks that will be embedded in next-generation mobile phones. The overall market for portable communication devices is booming; the segment concerning 3D technology using high-density through- silicon vias (TSVs) is forecast to reach 400-500 million units by 2011. In terms of benefits for the environment, die stacking should reduce the volume of consumables and energy needed to integrate complete heterogeneous circuits.

Objectives

The Verdi project's technological goal is to develop processes for building a 3D structure and demonstrate the processes' reliability and performance. The project targets applications needing a high number of vias. The densities used in this project (around 1 million TSV/cm²) are those required in telecommunications circuits, and leverage the full benefits of 3D integration. These densities require major technological breakthroughs in terms of TSV fabrication, thin plates, and bonding methods. A project demo will be designed using full computer modeling of the die stacking and 3D connections, and will illustrate the advantages of this technology.

Projet infos page d'un projet

Budget

11,394 K€

Duration

27 month

Human resources allocated

53.8 men/year