You are here

PHILEAS

PHILEAS

Phileas: Integrated, Reliable, Advanced Vacuum Packaging on Silicon

Completed

Project holder

ULIS

Partners

Tronics Microsystems, Leti

Non-members Partners

ONERA

Challenges

The Phileas project concerns the vacuum packaging used for uncooled infrared detectors and inertial sensors--both of which require low vacuum pressures (of <10-3 Torr) to function. Current vacuum packaging technologies are too expensive for use with infrared detectors for automotive and home automation applications, or with inertial sensors for the European aerospace industry.

Objectives

CEA-LETI has patented an innovative thin-film packaging technology that can create a vacuum at the chip level--therefore eliminating the need for a vacuum package--while using conventional packaging technologies. Furthermore, the new technology does not require an infrared window to be added for infrared detectors. This wafer-wafer packaging using direct silicon-on-silicon sealing performs particularly well in inertial sensors. The project will also develop getter technology that can improve vacuum quality after sealing.

Projet infos page d'un projet

Markets

Basic Technologies

Budget

9,822 K€

Duration

36 month

Human resources allocated

59.76 men/year