The Phileas project concerns the vacuum packaging used for uncooled infrared detectors and inertial sensors--both of which require low vacuum pressures (of <10-3 Torr) to function. Current vacuum packaging technologies are too expensive for use with infrared detectors for automotive and home automation applications, or with inertial sensors for the European aerospace industry.
CEA-LETI has patented an innovative thin-film packaging technology that can create a vacuum at the chip level--therefore eliminating the need for a vacuum package--while using conventional packaging technologies. Furthermore, the new technology does not require an infrared window to be added for infrared detectors. This wafer-wafer packaging using direct silicon-on-silicon sealing performs particularly well in inertial sensors. The project will also develop getter technology that can improve vacuum quality after sealing.