Huawei and ESI Sign a Memorandum of Understanding
To Foster Innovative HPC Solutions to Accelerate Industrial Manufacturing
ESI Group, leading innovator in Virtual Prototyping software and services for manufacturing industries worldwide, signed a Memorandum of Understanding (MoU) with Huawei, a leading global information and communications technology (ICT) solutions provider.
The signature ceremony took place during the event HUAWEI CONNECT 2016 in Shanghai, China on September 1, 2016. The two parties will collaborate on High-Performance Computing (HPC) and cloud computing to provide innovative industrial manufacturing solutions for customers in China and worldwide.
They also jointly released a white paper on the Huawei HPC platform-based ESI Virtual Performance Solution (VPS), a leading software solution used by industrial OEMs and their suppliers in order to test virtually all aspects of their product performance, including crash and safety. Often demanding large simulation models to achieve high levels of precision and predictive capabilities, VPS users greatly benefit from Huawei’s robust and efficient IT platforms, and the work done by Huawei and ESI to optimize the way their products work together.